Photopatternable silicone compositions for electronic packaging applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5376, Issue PART 1, 2004, Pages 517-524

  Harkness, Brian ^a   Gardner, Geoff ^a   Alger, James ^a   Cummings, Michelle ^a   Princing, Jennifer ^a   Lee, Yeong ^a   Meynen, Herman ^b   Gonzalez, Mario ^c   Vandevelde, Bart ^c   Vanden Bulcke, Mathieu ^c   Winters, Christophe ^c   Beyne, Eric ^c  

^a DOW CORNING CORPORATION   (United States)

^b Dow Corning SA Belgium   (Belgium)

^c IMEC   (Belgium)

Author keywords

Integration; Low Modulus; Low Stress; Patterning; Photo Lithography; Resist; Rework; Silicone; Spin on; Thick Film

Indexed keywords

BUILDING MATERIALS; CROSSLINKING; METALLIZING; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; SHRINKAGE; SILICONES; THICK FILMS;

LOW MODULUS; LOW STRESS; RESISTS; REWORK;

ELECTRONICS PACKAGING;

EID: 3843106808     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.533804     Document Type: Conference Paper

References (7)

1. th International Symposium on Microelectronics, IMAPS 2002, Denver, Colorado, p.795.
2. B. R. Harkness, R. L. Schalek, S. K. Sarmah, and L. T. Drzal, MRS Proceedings, Volume 769, 2003, Editors: B.R. Chalamala, B.E. Gnade, N. Fruehauf, J. Jang, pp. 297.
3. P. Gonon et al., results to be published.
4. M. Vanden Bulcke, M. Gonzalez, B. Vandevelde, C. Winters, E. Bayne, L. Larson, B.R. Harkness, G. Gardner, M. Mohammed, J. Sudbury-Holtschlag and H. Meynen, 5th Electronics Packaging Technology Conference (EPTC), Singapore, December 2003, pp. 380-384.
5. M. Gonzalez, B. Vandevelde, M. Vanden Bulcke, C. Winters, E. Beyne, Y.J. Lee, L. Larson, B.R. Harkness, M. Mohamed, H. Meynen, and E. Vanlathem, Electronic Components and Technology Conference (ECTC), New Orleans, Louisiana, May 2003, pp. 857-863.
6. M. Gonzalez, B. Vandevelde, M. Vanden Bulcke, C. Winters, E. Beyne, Y.J. Lee, L. Larson, B.R. Harkness, M. Mohamed and H. Meynen, 14th European Microelectronics and Packaging Conference and Exhibition, MAPS 2003, Friedrichshafen, Germany, pp 479-484.
7. Y. Lee et al., unpublished results.