Thermomechanical properties of functionally graded Al-SiCp composites

Materials Science Forum

Volumn 534-536, Issue PART 2, 2007, Pages 1565-1568

  Song, Dae Hyun ^a   Park, Yong Ha ^a   Park, Yong Ho ^a   Park, Ik Min ^a   Cho, Kyung Mox ^a  

^a Pusan National University   (South Korea)

Author keywords

Al SiCp; FGM; Microstructure; Pressureless infiltration; Thermomechanical properties

Indexed keywords

ALUMINUM COMPOUNDS; FUNCTIONALLY GRADED MATERIALS; MICROSTRUCTURE; SILICON COMPOUNDS; THERMOMECHANICAL TREATMENT;

PRESSURELESS INFILTRATION; THERMOMECHANICAL PROPERTIES;

COMPOSITE MATERIALS;

EID: 38349129026     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-419-7.1565     Document Type: Conference Paper

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