Study on the curing kinetics of the novel latent epoxy resin systems

Guofang Keji Daxue Xuebao/Journal of National University of Defense Technology

Volumn 28, Issue 2, 2006, Pages 31-34

  Xing, Su Li ^a   Wang, Zun ^a   Zeng, Jing Cheng ^a   Xiao, Jia Yu ^a   Yang, Fu Biao ^a   Qiu, Qiu Yuan ^a  

^a NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY   (China)

Author keywords

Curing kinetics; DSC analysis; Epoxy resin; Latent curing agent; Microcapsule

Indexed keywords

EID: 33744742307     PISSN: 10012486     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)