Micro heat pipes in low temperature cofire ceramic (LTCC) substrates

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 230-235

  Jones, W K ^a   Liu, Y ^a   Gao, M ^a  

^a The Department of Electrical and Computer Engineering   (United States)

Author keywords

Ceramics; Energy management; Lamination; Power generation; Project management; Rapid thermal processing; Shape; Temperature; Thermal conductivity; Thermal management

Indexed keywords

CAPILLARY FLOW; CERAMIC MATERIALS; ENERGY MANAGEMENT; HEAT PIPES; LAMINATING; MICROELECTRONICS; POWER GENERATION; PROJECT MANAGEMENT; RAPID THERMAL PROCESSING; SUBSTRATES; TEMPERATURE; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL;

CERAMICS; EFFECTIVE THERMAL CONDUCTIVITY; EVAPORATOR AND CONDENSERS; LAMINATION; LOW-TEMPERATURE CO-FIRED CERAMICS; MATERIALS AND PROCESS; SHAPE; VISCOELASTIC FLOWS;

THERMAL CONDUCTIVITY;

EID: 33847713828     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012462     Document Type: Conference Paper

References (11)

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8. R. Randukari, M. Zampino, W. K. Jones, "High Performance Thermal Vias in LTCC Substrates", Proc. 2002 ITherm, IEEE, San Diego, CA
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10. A. Roosen,"Novel Lamination Technique for Manufacture Ceramic Multilayer Devices", Proc. 2000 International Microelectronics Conference, IMAPS, Boston, MA 2000
11. W. K. Jones, Y. Liu, P. Wang, and M. Zampino, "Chemical, Structural and Mechanical Properties of LTCC Tapes" Int. J. Microcircuits and Electronic Packaging, Vol. 23, No. 4, 2000