The effects of annealing prior to dealloying on the mechanical properties of nanoporous gold microbeams

Acta Materialia

Volumn 56, Issue 3, 2008, Pages 324-332

  Seker, E ^a   Gaskins, J T ^a   Bart Smith, H ^a   Zhu, J ^a   Reed, M L ^a   Zangari, G ^a   Kelly, R ^a   Begley, M R ^a  

^a University of Virginia   (United States)

Author keywords

Annealing; Dealloying; Porous material; Self organization and patterning; Thin films

Indexed keywords

ANNEALING; BUCKLING; DISSOLUTION; GOLD; POROUS MATERIALS; RESIDUAL STRESSES; THIN FILMS;

DEALLOYING; PATTERNING; SELF-ORGANIZATION;

NANOPORES;

EID: 37849044867     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.08.048     Document Type: Article

References (25)

1. Huang J.-F., and Sun I.-W. Adv Funct Mater 15 (2005) 989
2. Lavrik N.V., Tipple C.A., Sepaniak M.J., and Datskos P.G. Biomed Dev 3 (2001) 35
3. Erlebacher J., Aziz M.J., Larma A., Dimitrov N., and Sieradzki K. Nature 410 (2001) 450
4. Erlebacher J. J Electrochem Soc 151 (2004) C614
5. Ding Y., Kim Y., and Erlebacher J. Adv Mater 16 (2004) 1897
6. Senior N.A., and Newman R.C. Nanotech 17 (2006) 2311
7. Kelly RG, Young AJ, Newman RC. The characterization of the coarsening of dealloyed layers by EIS and its correlation to stress-corrosion cracking. In: Scully JR, Silverman D, editors. West Conshohocken (PA): ASTM; 1993. p. 94.
8. Kelly R.G., Frost A.J., Shahrabi T., and Newman R.C. Metall Trans 22A (1991) 531
9. Sieradzki K., Corderman R.R., and Shukla K. Philos Mag A 59 (1989) 713
10. Dursun A., Pugh D.V., and Corcoran S.G. J Electrochem Soc 150 (2003) B355
11. Li R., and Sieradzki K. Phys Rev Lett 68 (1992) 1168
12. Biener J., Hodge A.M., and Hamza A.V. Appl Phys Lett 87 (2005) 121908
13. Biener J., Hodge A.M., Hamza A.V., Hsiung L.M., and Satcher J.H. Appl Phys Lett 97 (2005) 024301
14. Volkert C.A., Lilleodden E.T., Kramer D., and Weissmüller J. Appl Phys Lett 89 (2006) 061920
15. Lee D., Wei X., Chen X., Zhao M., Jun S.C., Hone H., Herbert E.G., Oliver W.C., and Kysar J.W. Scripta Mater 56 (2006) 437
16. Mathur A., and Erlebacher J. Appl Phys Lett 90 (2007) 061910
17. Hieda M., Garcia R., Dixon M., Daniel T., Allara D., and Chan M.H.W. Appl Phys Lett 84 (2004) 628
18. Ji C., and Searson P.C. Appl Phys Lett 81 (2002) 4437
19. Liu Z., and Searson P.C. J Phys Chem B 110 (2006) 4318
20. Zhu J., Seker E., Bart-Smith H., Begley M.R., Reed M., Kelly R., et al. Appl Phys Lett 89 (2006) 133104
21. Seker E., Gaskins J.T., Bart-Smith H., Zhu J., Reed M.L., Zangari G., et al. Acta Mater 55 (2007) 4593
22. Parida S., Kramer D., Volkert C.A., Rösner H., Erlebacher J., and Weissmüller J. Phys Rev Lett 97 (2006) 035504
23. Maner K.C., Begley M.R., and Oliver W.C. Acta Mater 52 (2004) 5451
24. Freund L.B., and Suresh S. Thin film materials (2003), Cambridge University Press, Cambridge
25. Begley M.R., and Barker N.S. J Micromech Microeng 16 (2006) 1