Aluminium-based packaging platform for LED using selectively anodising method

Electronics Letters

Volumn 44, Issue 1, 2008, Pages 24-25

  Kim, K M ^a   Shin, S H ^b   Lee, Y K ^b   Choi, S M ^b   Kwon, Y S ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANODIC OXIDATION; ETCHING; INTERCONNECTION NETWORKS; LIGHT EMITTING DIODES;

ISOTROPIC ETCHING; MICROREFLECTORS;

ELECTRONICS PACKAGING;

EID: 37249061217     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20081391     Document Type: Article

References (6)

1. Steele, R.V.: ' High-brightness LED market overview ', Proc. SPIE, 2001, 4445, p. 1-4
2. Steigerwald, D.A., Bhat, J.C., Collins, D.C., Fletcher, R.M., Holcomb, M.O., Ludowise, M.J., Martin, P.S., and Rudaz, S.L.: ' Illumination with solid state lighting technology ', IEEE J. Sel. Top. Quantum Electron., 2002, 8, p. 310-320 10.1109/2944.999186 1077-260X
3. Lee, J.-H., Shin, S.-H., Kim, K.M., and Kwon, Y.S.: ' Fabrication and analysis of high-Q inductor on anodized aluminum for high power package ', European Microwave Conf., September, 2006, p. 1387-1390
4. Kim, K.M., Shon, B., Yook, J.M., Yeo, S.K., and Kwon, Y.S.: ' Ultra-thin pocket embedded packaging for system in package ', Electron. Lett., 2007, 43, (6), p. 325-326 10.1049/el:20073758 0013-5194
5. Wermilk, S., Pinner, R., and Sheassby, R.G.: ' The surface treatment and finishing of aluminum and its alloys ', 5th edn. (Finishing Publications Ltd, 1987)
6. Henley, V.F.: ' Anodic oxidation of aluminium and its alloys ', (Pergamon Press, Oxford, UK, 1982)