Study of structural changes and properties of some Sn-Ag lead-free solder alloys

EPJ Applied Physics

Volumn 40, Issue 2, 2007, Pages 203-205

  Kamal, M ^a   Gouda, El Said ^b  

^a Mansoura University   (Egypt)

^b NATIONAL RESEARCH CENTRE   (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; ELASTIC MODULI; ELECTRON TRANSPORT PROPERTIES; INTERMETALLICS; TIN ALLOYS;

ADHESIVE FORCES; ELECTRICAL RESISTIVITY; MOLTEN ALLOYS; WETTING MEASUREMENTS;

SOLDERING ALLOYS;

EID: 36749005726     PISSN: 12860042     EISSN: 12860050     Source Type: Journal    
DOI: 10.1051/epjap:2007142     Document Type: Article

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