A study of the electronic flame off discharge process used for ball bonding in microelectronic packaging

American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED

Volumn 240, Issue , 1996, Pages 129-136

  Sripada, Srinivas S ^a   Cohen, I M ^a   Ayyaswamy, P S ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3643142905     PISSN: 08888116     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (23)

1. Chang, S. C., 1991, "Study of ball formation for wire bonding," Ph.D. Thesis, University of Pennsylvania, Philadelphia, PA.
2. Chang, S. C., Cohen, I. M., Huang, L. J., and Ayyaswamy, P. S., 1900, "Ball formation in wire bonding, pan II: real scale experimental study," International Journal for Hybrid Microelectronics, Vol. 13, No. 2, pp. 29-34.
3. Cohen, I. M., and Ayyaswamy, P. S., 1985, "Ball formation processes in aluminum bonding wire," Solid State Technology, Vol. 28, No. 12, pp. 89-92.
4. D'Ignazio, J., 1996, "Wire bonding's reign continues," Semiconductor International , June, pp. 117-126.
5. Donovan, K. G. and Cohen, I. M., 1991, "Two-dimensional analysis of electrical breakdown between a wire and a plane-extended," Journal of Applied Physics, Vol. 70, pp. 4132-4138.
6. Fritzsche, H., 1995, Private Communication, Institute of Semiconductor and Microsystem Technology, Technische Universitat, Dresden, Germany.
7. Gehman, B. L., Ritala, K. E., and Erickson, L.C., 1983, "Aluminum wire for thermosonic ball bonding in semiconductor devices," Solid State Tech., Vol. 26, No. 10, pp. 151-158.
8. Hirota, J., Machida, K., Okuda, T., Shimotomai, M., and Kawanaka, R., 1985, "The development of copper wire bonding for plastic molded semiconductor packages," Proceedings, 35th Electronic Components Conference, IEEE CHMT Division, pp. 116-121.
9. Huang, L. J., 1989, "Fundamental problems in heat transfer and fluid mechanics of phase change processes with liquid drops," Ph.D. Thesis, University of Pennsylvania, Philadelphia, PA.
10. Huang, L. J., Ayyaswamy, P. S. and Cohen, I. M., 1995a, "Melting and solidification of thin wires: a class of phase-change problems with a mobile interface-I. Analysis," International Journal of Heat and Mass Transfer, Vol. 38, No. 9, pp. 1637-1645.
11. Huang, L. J., Ayyaswamy, P. S. and Cohen, I. M., 1995b, "Melting and solidification of thin wires: a class of phase-change problems with a mobile interface-II. Experimental Confirmation," International Journal of Heat and Mass Transfer, Vol. 38, No. 9, pp. 1647-1659.
12. Huang, L. J., Jog, M. A., Cohen, I. M., and Ayyaswamy, P. S., 1991, "Effect of polarity on heat transfer in ball formation process," ASME Journal of Electronic Packaging, Vol. 113, pp. 33-39.
13. Huang, L. J., Ramakrishna, K., Ayyaswamy, P. S. and Cohen, I. M., 1989, "An analysis of shrinkage porosity in aluminum ball bonding process," ASME Journal of Electronic Packaging, Vol. 111, No. 3, pp. 199-206.
14. Huang, L. J., Yu, K. M., Powell, S., Cohen, I. M., and Ayyaswamy, P. S., 1990, "Ball formation in wire bonding, part I: Upscaled experimental study," International Journal for Hybrid Microelectronics, Vol. 13, No. 1, pp. 1-5.
15. Jog, M. A., Cohen, I. M., and Ayyaswamy, P. S., 1991, "Break-down of a wire-to-plane discharge," Physics of Fluids B, Vol. 3, pp. 3532-3536.
16. Jog, M. A., Cohen, I. M., and Ayyaswamy, P. S., 1992, "Electrode heating in a wire-to-plane arc," Physics of Fluids B Vol. 4, pp. 465-472.
17. Kurtz, J., Cousens, D. and Dufour, M., 1984, "Copper wire bonding," Proceedings, 34th Electronic Components Conference, IEEE CHMT Division, New Orleans, LA, pp. 1-6.
18. McGill, G., Weilerstein, M., Venkatesh, R., and Keverian, J., 1983, "Aluminum wire as a viable alternative to gold for ball bonding," Semiconductor International, August, pp. 91-95.
19. Nguyen, L. T., McDonald, D., Danker, A. R., and Ng, P., 1995, "Optimization of copper wire bonding on Al-Cu metalization," IEEE Transactions on Components, Packaging, and Manufacturing Technology A, Vol. 18, No. 2, pp. 423-429.
20. Onuki, J., Suwa, M., Iizuka, T. and Okikawa, S., 1984, "Study of aluminum ball bonding for semiconductors," Proceedings, 34th Electronic Components Conference, IEEE CHMT Division, New Orleans, LA, pp. 7-12.
21. Otto, A.J., 1987, "Aluminum wire for ball bonding," Proceedings, 37th Electronic Components Conference, IEEE CHMT Division, New Orleans, LA, pp. 550-556.
22. Qin, W., Cohen, I. M., and Ayyaswamy, P. S., 1995, "Non-equilibrium simulation of ball formation from a bonding wire: An application in microelectronic interconnection," 1995, Symposium on Thermal Science and Engineering in honor of Chancellor Chang-Lin Tien, University of California, Berkeley, CA.
23. Vacek, D. J. and Cohen, I. M., 1989, " Model of a wire-to-plane electric arc," Journal of Applied Physics, Vol. 65, pp. 1005-1008.