Wirebonding's reign continues

Semiconductor International

Volumn 19, Issue 6, 1996, Pages 117-126

  D'Ignazio, John ^a  

^a NONE

Author keywords

Ball vs. wedge bonding; Machine automation; Thermosonic energy

Indexed keywords

EID: 3643056808     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (1)

1. "Advanced Thin & Fine Pitch Packaging Design, Materials, Processing & Reliability Aspects." SEMI Technical Education Program. SEMICON/West 95. p. 80.