Effect of defects on thermal performance of carbon nanotube investigated by molecular dynamics simulation

2006 International Conference on Electronic Materials and Packaging, EMAP

Volumn , Issue , 2006, Pages

  Fan, Haibo ^a   Zhang, Kai ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; CARBON NANOTUBES; ELECTRONICS PACKAGING; MATERIALS PROPERTIES; MIXED CONVECTION; MOLECULAR DYNAMICS; NANOSTRUCTURES; NANOTUBES; PACKAGING; PACKAGING MATERIALS; QUANTUM CHEMISTRY; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

ELECTRONIC PACKAGING;

DYNAMICS;

EID: 51449090313     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430651     Document Type: Conference Paper

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