Interaction of environmental conditions: Role in the reliability of active implantable devices

Proceedings of the 2nd Frontiers in Biomedical Devices Conference 2007

Volumn , Issue , 2007, Pages 131-132

  Drexler, Elizabeth S ^a   Slifka, Andrew J ^a   Barbosa III, Nicholas ^a   Drexler, John W ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 36249018308     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/BioMed2007-38072     Document Type: Conference Paper

References (2)

1. Meyer, J.-U., Stieglitz, T., Scholz, O., Haberer, W., and Beutel, H., 2001, "High Density Interconnects and Flexible Hybrid Assemblies for Active Biomedical Implants," IEEE Transactions on Advanced Packaging, 24, 366-374.
2. Vaeth, K. M., and Jensen, K. F., 2000, "Transition Metals for Selective Chemical Vapor Deposition of Parylene-Based Polymers," Chemistry of Materials, 12, 1305-1313.