Fabrication process for a flexible tag microlab

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6589, Issue , 2007, Pages

  Abad, E ^a   Mazzolai, B ^b   Juarros, A ^a   Gomez D ^a   Mondini, A ^b   Sayhan, I ^c   Krenkow, A ^c   Becker, Th ^c  

^a IK4 TEKNIKER   (Spain)

^b SCUOLA SUPERIORE SANT ANNA   (Italy)

^c AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

ACA flip chip; COF bonding; Flexible substrate technologies; MOX sensors; RFID systems

Indexed keywords

CHEMICAL SENSORS; COPPER ALLOYS; FLIP CHIP DEVICES; LASER ABLATION; PHOTOLITHOGRAPHY; ULTRASHORT PULSES;

ACA FLIP CHIPS; COF BONDING; FLEXIBLE SUBSTRATE TECHNOLOGIES; MOX SENSORS; RFID-SYSTEMS;

SMART SENSORS;

EID: 36248961068     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.723737     Document Type: Conference Paper

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