Biocompatible parylene neurocages: Developing a robust method for live neural network studies

IEEE Engineering in Medicine and Biology Magazine

Volumn 24, Issue 6, 2005, Pages 30-33

  Tooker, Angela ^a,d   Meng, Ellis ^b   Erickson, Jon ^c   Tai, Yu Chong ^a   Pine, Jerry ^a  

^a California Institute of Technology   (United States)

^b University of Southern California ^*  (United States)

^c California Institute of Technology   (United States)

^d CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMATERIAL; PARYLENE; UNCLASSIFIED DRUG;

ARTICLE; BIOCOMPATIBILITY; CLEANING; NANODEVICE; NANOFABRICATION; NERVE CELL NETWORK; NEUROCAGE; SCANNING ELECTRON MICROSCOPY;

EID: 36049000514     PISSN: 07395175     EISSN: None     Source Type: Journal    
DOI: 10.1109/MEMB.2005.1549727     Document Type: Article

References (7)

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2. Y. Jimbo, T. Tateno, and H.P.C. Robinson, "Simultaneous induction of pathway-specific potentiation and depression in networks of cortical neurons," Biophysical J., vol. 76, no. 2, pp. 670-678, Feb. 1999.
3. J.A. Wright, S.T. Lucic, Y.C. Tai, M.P. Maher, H. Dvorak, and J. Pine, "Towards a functional MEMS neurowell by physiological experimentation, " in ASME Int. Mech. Eng. Congr. Exposition, Atlanta, GA, 1996, DSC-vol. 59, pp. 333-338.
4. M.P. Maher, J. Pine, J. Wright, and Y.C. Tai, "The neurochip: A new multielectrode device for stimulating and recording from cultured neurons," J. Neurosci. Methods, vol. 87, no. 1, pp. 45-56, 1999.
5. Q. He, E. Meng, Y.C. Tai, C.M. Rutherglen, J. Erickson, and J. Pine, "Parylene neurocages for live neural networks study," in 12th IEEE Int. Conf. Solid-State Sensors, Actuators and Microsyst., Boston, MA, 2003, pp. 995-998.
6. E. Meng, Y.C. Tai, J. Erickson, and J. Pine, "Parylene technology for mechanically robust neurocages," MicroTAS 2003, pp. 1109-1112.
7. M. Liger, D.C. Rodger, and Y.C. Tai, "Robust parylene-to-silicon mechanical anchoring," in 16th IEEE Int. Conf. Micro Electro Mech. Syst., MEMS'03, Kyoto, Japan, 2003, pp. 602-605.