Computational characterization of adhesive layer properties using guided waves in bonded plates

Journal of Nondestructive Evaluation

Volumn 26, Issue 2-4, 2007, Pages 97-105

  Koreck, Juergen ^a   Valle, Christine ^b   Qu, Jianmin ^b   Jacobs, Laurence J ^a,b  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesive bonds; Dispersion curves; Finite element method; Guided waves; Lamb waves

Indexed keywords

DISPERSION CURVE; FREQUENCY-WAVENUMBER; GLOBAL MATRIX METHOD; SLOWNESS-FREQUENCY;

ABAQUS; ADHESIVES; BOND STRENGTH (MATERIALS); ELASTIC MODULI; FINITE ELEMENT METHOD; GUIDED ELECTROMAGNETIC WAVE PROPAGATION; PLATES (STRUCTURAL COMPONENTS); POISSON RATIO; STIFFNESS; TIME DOMAIN ANALYSIS;

NONDESTRUCTIVE EXAMINATION;

EID: 36048963875     PISSN: 01959298     EISSN: 15734862     Source Type: Journal    
DOI: 10.1007/s10921-007-0024-y     Document Type: Article

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