Residual stresses of Ni alloy electrodeposits containing low levels of Fe, P, and B

Metals and Materials International

Volumn 13, Issue 5, 2007, Pages 365-369

  Seo, Moo Hong ^a   Kim, Dong Jin ^b   Kim, Joung Soo ^b  

^a Samsung Electro Mechanics   (South Korea)

^b Korea Atomic Energy Research Institute   (South Korea)

Author keywords

Ni alloy electrodeposits; Residual stresses; Sulfamate bath

Indexed keywords

ALLOYING; ALLOYING ELEMENTS; DEPOSITS; ELECTRODES; ELECTROLYTES; HYDRIDES; RESIDUAL STRESSES; TENSILE STRESS;

DIRECT CURRENT; NI ALLOYS; PROCESS PARAMETERS; PULSE CURRENTS; REVERSE CURRENTS; REVERSE PULSE CURRENTS; STRESS VALUES; SULFAMATE BATH;

NICKEL ALLOYS;

EID: 35948994110     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027869     Document Type: Article

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