HDVIP™ FPA technology at DRS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4369, Issue , 2001, Pages 566-578

  Kinch, Michael A ^a  

^a DRS Sensors and Targeting Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; MERCURY COMPOUNDS; SCANNING; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MODELS; TEMPERATURE;

FOCAL PLANE ARRAY; HIGH DENSITY VERTICALLY INTEGRATED PHOTODIODE; LONG WAVE INFRARED; MERCURY CADMIUM TELLURIDE; MIDWAVE INFRARED; READOUT INTEGRATED CIRCUIT;

PHOTODIODES;

EID: 0035760455     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.445316     Document Type: Conference Paper

References (6)

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2. T. N. Casselman, and S. Krishnamurthy, Proc. 1999 US Workshop on Phys. and Chem. of II-VI Materials
3. A. R. Beattie, private communication.
4. R. A. Shiebel, IEEE Trans. Electron Devices 41, 768 (1994)
5. M. A. Kinch, J. Electron. Mater. 29, 809 (2000)
6. C.T. Elliott, and T. Ashley, Electronics Letters 21, 451 (1985)