Metal powder injection molding of copper and copper alloys for microelectronic heat dissipation

International Journal of Powder Metallurgy (Princeton, New Jersey)

Volumn 43, Issue 5, 2007, Pages 55-63

  German, Randall M ^a   Johnson, John L ^b  

^a MISSISSIPPI STATE UNIVERSITY   (United States)

^b ATI Alldyne   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; ELECTRODEPOSITION; INJECTION MOLDING; MICROELECTRONICS; MICROPROCESSOR CHIPS; POWDER METALS; THERMAL CONDUCTIVITY;

CHEMICAL PRECIPITATION; METAL POWDER INJECTION MOLDING; MICROELECTRONIC HEAT DISSIPATION; WATER ATOMIZATION;

HEAT LOSSES;

EID: 35649022253     PISSN: 08887462     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

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