Comparison between Cu-Ni alloy powder and Cu, Ni powder mixture by metal injection molding

Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy

Volumn 44, Issue 6, 1997, Pages 604-611

  Wada, Noriyuki ^a   Kankawa, Yoshimitsu ^b   Kaneko, Yasunari ^a  

^a RITSUMEIKAN UNIVERSITY   (Japan)

^b Kyoto Municipal Institute of Industrial Technology and Culture   (Japan)

Author keywords

Electrolytic copper powder; Hydrogen treatment; Injection molding; MIM; Sintering

Indexed keywords

BINARY ALLOYS; BINDERS; CARBON; COMPOSITION EFFECTS; DENSITY (SPECIFIC GRAVITY); METAL MOLDING; NICKEL ALLOYS; OXYGEN; SINTERING; THERMAL EFFECTS;

ELECTROLYTIC COPPER POWDER; HYDROGEN TREATMENT; METAL INJECTION MOLDING;

COPPER POWDER;

EID: 0031169649     PISSN: 05328799     EISSN: None     Source Type: Journal    
DOI: 10.2497/jjspm.44.604     Document Type: Review

References (5)

1. Ritsu Miura, Yasuo Endo, Hirokazu Hanme, Kiyotsugu Takamori: Powder and Powder Metallurgy, 42(1995)367.
2. Katsuyoshi Saito: The latest injection molding technology for metal powders, General Technology Center, (1988)7-9.
3. Hiroshi Takigawa: Die Technology, 6(1991)29.
4. Katsufumi Ono, Yoshimitu Kankawa and asunari Kaneko: Powder and Powder etallurgy, 41 (1994)227.
5. Taikan Rin and Hiro hayashi: Powder and Powder Metallurgy, 40(1993)374-376.