Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids

Biomedical Microdevices

Volumn 9, Issue 6, 2007, Pages 939-949

  Park, Woo Tae ^a   O'Connor, Kevin N ^b   Chen, Kuan Lin ^a   Mallon Jr , Joseph R ^a   Maetani, Toshiki ^b   Dalal, Parmita ^a   Candler, Rob N ^a   Ayanoor Vitikkate, Vipin ^a   Roberson, Joseph B ^b,c   Puria, Sunil ^a,b   Kenny, Thomas W ^a  

^a Stanford University   (United States)

^b STANFORD UNIVERSITY   (United States)

^c California Ear Institute   (United States)

Author keywords

Accelerometer; Epi poly encapsulation; Flex circuit; Implantable hearing aids

Indexed keywords

ACCELEROMETERS; ELECTRIC CABLES; ENCAPSULATION; SILICON; VIBRATIONS (MECHANICAL);

PIEZORESISTIVE SILICON ACCELEROMETER; SIGNAL ATTENUATION; SOUND SENSOR;

HEARING AIDS;

SILICON;

ACCELEROMETER; ARTICLE; AUDITORY RESPONSE; AUDITORY STIMULATION; BIOCOMPATIBILITY; BIOSENSOR; FEASIBILITY STUDY; HEARING AID; HUMAN; HUMAN TISSUE; MICROENCAPSULATION; MIDDLE EAR IMPLANT; PRIORITY JOURNAL; SOUND DETECTION; SOUND TRANSMISSION;

ACCELERATION; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HEARING AIDS; HUMANS; MINIATURIZATION; PROSTHESES AND IMPLANTS; TRANSDUCERS; VIBRATION;

EID: 35648986049     PISSN: 13872176     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10544-007-9072-4     Document Type: Article

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