Thermoelectric enhancement at low temperature in nonstoichiometric lead-telluride compounds

Journal of Physics D: Applied Physics

Volumn 40, Issue 21, 2007, Pages 6839-6845

  Wang, Heng ^a   Li, Jing Feng ^a   Kita, Takuji ^b  

^a TSINGHUA UNIVERSITY   (China)

^b Higashifuji Technical Center   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; SPARK PLASMA SINTERING; STOICHIOMETRY; THERMAL CONDUCTIVITY; THERMOELECTRICITY; TRANSMISSION ELECTRON MICROSCOPY;

MICROSTRUCTURAL CHARACTERIZATION; NANOFEATURES; NONSTOICHIOMETRIC COMPOUNDS; THERMOELECTRIC ENHANCEMENT;

LEAD COMPOUNDS;

EID: 35548929496     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/40/21/053     Document Type: Article

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