Blind characterization of materials using single-sided thermography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5405, Issue , 2004, Pages 442-446

  Shepard, Steven M ^a   Lhota, James R ^a   Hou, Yulin ^a   Ahmed, Tasdiq ^a  

^a Thermal Wave Imaging   (United States)

Author keywords

Nondestructive; Thermography

Indexed keywords

FULL WIDTH HALF MAXIMUM; SINGLE PIXEL ANALYSIS; SUBSURFACE; THERMAL DIFFUSIVITY;

CAMERAS; DIFFUSION; IMAGE PROCESSING; LEAST SQUARES APPROXIMATIONS; MATHEMATICAL MODELS; SIGNAL PROCESSING; THERMODYNAMIC PROPERTIES;

THERMOGRAPHY (IMAGING);

EID: 3543133548     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.546596     Document Type: Conference Paper

References (6)

1. Vavilov, "Infrared Techniques for Materials Analysis and Nondestructive Testing ", IR Methodology and Technology, International Advances in NDT, X. Maldague, Ed., pp. 230-309, Gordon and Breach, US, 1994.
2. Ringermacher, H.I., Mayton, D.J., Howard, D.R., and Cassenti, B.N., "Towards a Flat Bottom Hole Standard for Thermal Imaging", Review of Progress in Quantitative NDE, Vol. 17, Eds. D.O. Thompson and D.E. Chimenti, Plenum Press, NY., 1998.
3. Maldague X.V., Nondestructive Evaluation of Materials by Infrared Thermography, Springer Verlag, 1993, p. 158.
4. Shepard, S.M., Lhota, J.R., Rubadeux, B.A., Wang, D. and Ahmed, T., "Reconstruction and Enhancement of Active Thermographic Image Sequences", Optical Engineering, Vol. 42 No. 5, SPIE, May 2003, pp. 1337-1342.
5. Shepard and Ahmed, "Characterization of Active Thermographic System Performance", Proc. SPIE Thermosense XXI, Vol. 3700, pp. 388-392, April 1999.
6. EchoTherm® (Thermal Wave Imaging, Inc.), U.S. Patent 6, 516, 084.