Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder joints

Journal of Materials Science

Volumn 40, Issue 9-10, 2005, Pages 2547-2551

  Sobczak, N ^a   Sobczak, J ^a   Nowak, R ^a   Kudyba, A ^a   Darlak, P ^a   Mikulowski, B ^b   Wojciechowski, A ^c  

^a Lukasiewicz Research Network Krakow Institute of Technology   (Poland)

^b AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

^c MOTOR TRANSPORT INSTITUTE   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; INTERFACES (MATERIALS); MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SOLIDIFICATION; THERMAL CYCLING; TIN ALLOYS; WETTING;

INTERFACE STRUCTURE; PUSH-OFF SHEAR TEST; SESSILE DROP METHOD; STRUCTURAL STABILITY;

SOLDERED JOINTS;

EID: 21144435945     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-1990-z     Document Type: Conference Paper

References (14)

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