Interaction of voids and nanoductility in silica glass

Physical Review Letters

Volumn 99, Issue 15, 2007, Pages

  Chen, Yi Chun ^a   Lu, Zhen ^a   Nomura, Ken Ichi ^a   Wang, Weiqiang ^a   Kalia, Rajiv K ^a   Nakano, Aiichiro ^a   Vashishta, Priya ^a  

^a UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DUCTILITY; LIGAMENTS; MICROCRACKS; NANOMECHANICS; NUCLEATION; STRAIN; SWITCHING; VOID FRACTION;

BOND BREAKING; CAVITIES; HYDROSTATIC TENSION; INTERVOID LIGAMENTS; METALLIC ALLOYS;

FUSED SILICA;

EID: 35248823684     PISSN: 00319007     EISSN: 10797114     Source Type: Journal    
DOI: 10.1103/PhysRevLett.99.155506     Document Type: Article

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