Contact leakage and open monitoring with an advanced e-beam inspection system

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6518, Issue PART 3, 2007, Pages

  Lei, Shuen Chen ^a   Liu, Hermes ^a   Tsai, Mingsheng ^a   Wu, Hung Chi ^b   Xiao, Hong ^b   Jau, Jack ^b  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b Hermes Microvision Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION MEASUREMENT; CORRELATION METHODS; DEFECTS; MONITORING;

CONTACT LEAKAGE; DIE YIELDS; OPEN MONITORING; POSITIVE MODE INSPECTIONS;

ELECTRON BEAMS;

EID: 35148852072     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.711761     Document Type: Conference Paper

References (4)

1. st International Symposium for Testing and Failure Analysis, pp. 448, 2005.
2. Kirin Wang, et al., Proceeding of IEEE International Symposium of Semiconductor Manufacturing, pp. 472, 2005
3. X. Liu, et al., J. Vac. Sci. Tech. B, 22, pp.3534-3538, 2004.
4. L. Reimer, "Scanning Electron Microscopy, Physics of Image Formation and Microanalysis", 2nd Ed., Springer, New York, 1998.