Heat spreader with aligned CNTs designed for thermal management of HB-LED packaging and microelectronic packaging

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Zhang, Kai ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; LIGHT EMITTING DIODES; MICROELECTRONICS; TEMPERATURE CONTROL;

CNT ARRAYS; HEAT SPREADERS; HIGH-BRIGHTNESS LIGHT EMITTER DIODE (HB-LED); MICROELECTRONIC PACKAGING;

CARBON NANOTUBES;

EID: 34948901275     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359779     Document Type: Conference Paper

References (10)

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