Influence of current density on synthesized technique and microstructure of nanocrystalline Cu deposition

Jilin Daxue Xuebao (Gongxueban)/Journal of Jilin University (Engineering and Technology Edition)

Volumn 37, Issue 5, 2007, Pages 1074-1077

  Zhang, Han Zhuo ^a   Jiang, Zhong Hao ^a   Lian, Jian She ^a   Li, Guang Yu ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

Cu; Current density; Electrodeposition; Materials examination and analysis; Nanocrystalline

Indexed keywords

CURRENT DENSITY; DIFFRACTOMETERS; ELECTRODEPOSITION; ELECTRON MICROSCOPY; GROWTH (MATERIALS); MICROHARDNESS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; POROSITY; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

CU; MATERIALS EXAMINATION ANALYSIS; NANOCRYSTALLINE;

NANOCRYSTALLINE MATERIALS;

EID: 34948890013     PISSN: 16715497     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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