Consolidation of HIP bonding technologies for the ITER first wall panels

Fusion Engineering and Design

Volumn 82, Issue 15-24, 2007, Pages 1806-1812

  Sherlock, P ^a   Peacock, A T ^b   Rodig M ^c  

^a AMEC NNC Limited   (United Kingdom)

^b EFDA CLOSE SUPPORT UNIT   (Germany)

^c FORSCHUNGSZENTRUM JÜLICH   (Germany)

Author keywords

Beryllium; Copper; First wall panel; HIP; Plasma facing

Indexed keywords

BERYLLIUM; BREEDING BLANKETS; HEAT FLUX; LOW TEMPERATURE EFFECTS; SOFTWARE PROTOTYPING;

ALLOY BONDING PROCESS; FIRST WALL BLANKETS; FIRST WALL PANEL; HIP BONDING TECHNOLOGIES;

HOT ISOSTATIC PRESSING;

EID: 34948879614     PISSN: 09203796     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.fusengdes.2007.03.056     Document Type: Article

References (9)

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