Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanket

Fusion Engineering and Design

Volumn 66-68, Issue , 2003, Pages 425-429

  Sherlock, P ^a   Erskine, A ^a   Lorenzetto, P ^b   Peacock, A T ^b  

^a NNC Ltd   (United Kingdom)

^b MAX PLANCK INSTITUT FÜR PLASMAPHYSIK   (Germany)

Author keywords

Beryllium; Bonding; CuCrZr; Plasma facing component

Indexed keywords

BERYLLIUM; BONDING; COPPER; DIFFUSION; HEAT SINKS; PLASMAS; THERMAL CONDUCTIVITY;

PLASMA FACING MATERIALS;

FUSION REACTIONS;

EID: 0141495463     PISSN: 09203796     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0920-3796(03)00184-4     Document Type: Conference Paper

References (4)

1. M. Rödig, et al. Simulation of vertical displacement events (VDE) and thermal fatigue on actively-cooled beryllium-copper mock-ups, Fifth IEA International Workshop on Beryllium Technology for Fusion, Moscow, October 2001, pp. 53-58.
2. M. Merola, et al. Influence of the manufacturing heat cycles on the CuCrZr properties, Tenth International Conference on Fusion Reactor Materials, Baden-Baden (D), October 2001, Paper T1 1-391.
3. P. Lorrenzetto, et al. The EU HT programme of ITER primary small scale mock ups, 20th SOFT Marseille, 1998, pp. 195-198.
4. M. Merola, et al. Manufacture and testing of baffle and limiter mock-ups with beryllium armour, Fifth IEA International Workshop on Beryllium Technology for Fusion, Moscow, October 2001, pp. 24-27.