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Volumn 66-68, Issue , 2003, Pages 425-429
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Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanket
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Author keywords
Beryllium; Bonding; CuCrZr; Plasma facing component
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Indexed keywords
BERYLLIUM;
BONDING;
COPPER;
DIFFUSION;
HEAT SINKS;
PLASMAS;
THERMAL CONDUCTIVITY;
PLASMA FACING MATERIALS;
FUSION REACTIONS;
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EID: 0141495463
PISSN: 09203796
EISSN: None
Source Type: Journal
DOI: 10.1016/S0920-3796(03)00184-4 Document Type: Conference Paper |
Times cited : (10)
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References (4)
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