Tightly coupling LTCC microwave coupled lines: Analysis, modeling and realization

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 391-396

  Deng, J D S ^a   Hsiao, Feng Ka ^a   Kuo, J I ^a   Horng, Kuo Young ^a   Lee, Ching Yuan ^a   Wu, Chung Sen ^a  

^a CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

PACKAGING MATERIALS;

ANALYSIS AND MODELING; ASYMMETRICAL COUPLED LINES; DIFFERENT LAYERS; EXTRACTION TECHNIQUES; LTCC SUBSTRATES; MODEL AND ANALYSIS; MULTI-CONDUCTOR; PHYSICAL STRUCTURES;

MODIFIED ATMOSPHERE PACKAGING;

EID: 34748918630     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188871     Document Type: Conference Paper

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