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Volumn , Issue , 2003, Pages 826-833
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Thermal Analysis of a Multi-Chip SI/SIC-Power Module for Realization of a Bridge Leg of a 10kW Vienna Rectifier
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
COOLING SYSTEMS;
ELECTRIC RECTIFIERS;
FREQUENCY MODULATION;
POWER ELECTRONICS;
PULSE WIDTH MODULATION;
SEMICONDUCTOR JUNCTIONS;
SILICON CARBIDE;
THERMOANALYSIS;
THERMOCOUPLES;
BRIDGE LEG;
FREE-WHEELING DIODES;
POWER SEMICONDUCTOR MODULES;
THERMAL TIME CONSTANTS;
SEMICONDUCTOR DEVICE MODELS;
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EID: 1542330073
PISSN: 02750473
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (17)
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References (8)
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