The influence of the size effect of copper interconnects on RC delay variability beyond 45nm technology

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 10-12

  Kitada, H ^a   Suzuki, T ^a   Kimura, T ^a   Kudo, H ^a   Ochimizu, H ^a   Okano, S ^a   Tsukune, A ^a   Suda, S ^a   Sakai, S ^a   Ohtsuka, N ^a   Tabira, T ^a   Shirasu, T ^a   Sakamoto, M ^a   Matsuura, A ^a   Asada, Y ^a   Nakamura, T ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER COMPOUNDS; ELECTRIC CONDUCTIVITY; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; SPICE; TIME DELAY;

COPPER INTERCONNECTS; DELAY TIME DISTRIBUTION; RC DELAY VARIABILITY; SIZE EFFECTS;

OPTICAL INTERCONNECTS;

EID: 34748853301     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382333     Document Type: Conference Paper

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