Materials characterization of WNxCy, WNx and WCx films for advanced barriers

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2460-2465

  Volders, H ^a   Tokei Z ^a   Bender, H ^a   Brijs, B ^a   Caluwaerts, R ^a   Carbonell, L ^a   Conard, T ^a   Drijbooms, C ^a   Franquet, A ^a   Garaud, S ^a   Hoflijk, I ^a   Moussa, A ^a   Sinapi, F ^a   Travaly, Y ^a   Vanhaeren, D ^a   Vereecke, G ^a   Zhao, C ^a   Li, W M ^b   Sprey, H ^c   Jonas, A M ^d  

^a IMEC   (Belgium)

^b ASM Microchemistry Oy   (Finland)

^c ASM BELGIUM   (Belgium)

^d UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

ALD; Atomic layer deposition; Barrier; WCx; WNx; WNxCy

Indexed keywords

AMMONIA; ATOMIC LAYER DEPOSITION; CORROSION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TUNGSTEN COMPOUNDS;

CHEMICAL OXIDE; TRIETHYL BORANE (TEB); TUNGSTEN HEXAFLUORIDE;

METALLIC FILMS;

EID: 34548813861     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.023     Document Type: Article

References (6)

1. Kaloyeros A.E., and Eisenbraun E. Annual Review of Materials Science 30 (2000) 363-385
2. Becker J.S., and Gordon R.G. Applied Physics Letters vol. 82 14 (2003) 2239-2241
3. Becker J.S., Suh S., Wang S., and Gordon R.G. Chemistry of Materials 15 15 (2003) 2969-2976
4. y Films, Thesis Presented to the Catholic University of Leuven, Faculty of Electrical Engineering, 2006.
5. Travaly Y., Schuhmacher J., Hoyas A.M., Van Hove M., Maex K., Abell T., Sutcliffe V., and Jonas A.M. Journal of Applied Physics 97 (2005) 084316
6. Hoyas A.M., Schuhmacher J., Shamiryan D., Waeterloos J., Besling W., Celis J.P., and Maex K. Journal of Applied Physics 95 1 (2004) 381-388