Investigation into the mechanical contact behavior of single asperities using static atomistic simulations

Applied Physics Letters

Volumn 91, Issue 9, 2007, Pages

  Jeng, Yeau Ren ^a   Kao, Wei Cheng ^a   Tsai, Ping Chi ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; CONTINUUM DAMAGE MECHANICS; COPPER COMPOUNDS; INTERFACES (MATERIALS); MATHEMATICAL MODELS;

ELASTOPLASTIC CONTACT INTERFACE; MECHANICAL CONTACT BEHAVIOR; SINGLE ASPERITIES; STATIC ATOMISTIC SIMULATIONS;

SURFACE ROUGHNESS;

EID: 34548413682     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2776019     Document Type: Article

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