Analysis of thermally expandable flexible fluidic thin-film channels

Journal of Heat Transfer

Volumn 129, Issue 7, 2007, Pages 813-818

  Khaled, A R A ^a   Vafai, K ^b  

^a KING ABDULAZIZ UNIVERSITY   (Saudi Arabia)

^b University of California Riverside   (United States)

Author keywords

Electronic cooling; Flexible plate; Heat transfer; MEMS; Seals; Thermal expansion; Thin films

Indexed keywords

COOLING; FLUIDIC DEVICES; MEMS; PECLET NUMBER; REYNOLDS EQUATION; THERMAL EXPANSION; THIN FILMS;

CONSTANT VOLUMETRIC THERMAL EXPANSION COEFFICIENT; ELECTRONIC COOLING; LINEAR ELASTICITY; THERMALLY EXPANDABLE FLEXIBLE THIN FILMS;

HEAT TRANSFER;

COOLING; FLUIDIC DEVICES; HEAT TRANSFER; MEMS; PECLET NUMBER; REYNOLDS EQUATION; THERMAL EXPANSION; THIN FILMS;

EID: 34548230900     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2712853     Document Type: Article

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