Comparison between underfloor supply and overhead supply ventilation designs for data center high-density clusters

ASHRAE Transactions

Volumn 113 PART 1, Issue , 2007, Pages 115-125

  Schmidt, Roger R ^a,b   Iyengar, Madhusudan ^a,b  

^a ASHRAE ^*

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; ELECTRONIC EQUIPMENT; INVESTMENTS; MATHEMATICAL MODELS; NUMERICAL METHODS; OPTIMIZATION; TEMPERATURE CONTROL;

COMPUTING FACILITY; DATA CENTERS; RACK AIR INLET TEMPERATURES;

INFORMATION SERVICES;

EID: 34547974993     PISSN: 00012505     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. ASHRAE. 2005. Datacom Equipment Power Trends and Cooling Applications. Atlanta: American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.
2. Schmidt, R. 2004. Thermal profile of a high-density data center-Methodology to thermally characterize a data center. ASHRAE Transactions 110(2):635-42.
3. 2. ASHRAE Transactions 111(2):765-77.
4. Schmidt, R., M. Iyengar, and S. Mayhugh. 2006. Thermal profile of world's third fastest supercomputer - IBM's ASCI Purple Cluster. ASHRAE Transactions 112(2).