Study of nanosized Zinc Oxide on Cu-Zn alloy substrate using Taguchi method

Surface and Coatings Technology

Volumn 201, Issue 22-23 SPEC. ISS., 2007, Pages 9238-9242

  Liu, W L ^a   Hsieh, S H ^a   Chen, W J ^b   Lee, J H ^a  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Cu Zn substrate; Nanosize; Taguchi method; Zinc Oxide (ZnO)

Indexed keywords

COPPER ALLOYS; DIFFUSION; ELECTRODEPOSITION; ENERGY DISPERSIVE SPECTROSCOPY; GROWTH (MATERIALS); GROWTH TEMPERATURE; SCANNING ELECTRON MICROSCOPY; TAGUCHI METHODS;

GROWTH TIME; NANOSIZE;

ZINC OXIDE;

COPPER ALLOYS; DIFFUSION; ELECTRODEPOSITION; ENERGY DISPERSIVE SPECTROSCOPY; GROWTH (MATERIALS); GROWTH TEMPERATURE; SCANNING ELECTRON MICROSCOPY; TAGUCHI METHODS; ZINC OXIDE;

EID: 34547653132     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.04.064     Document Type: Article

References (19)

1. Wang Z.L., Kong X.Y., Ding Y., Gao P., Hughes W.L., Yang R., and Zhang Y. Adv. Funct. Mater. 14 (2004) 943
2. Kong Y.C., Yu D.P., Zhang B., Fang W., and Feng S.Q. Appl. Phys. Lett. 84 (2004) 3376
3. Wu J.J., and Liu S.C. J. Phys. Chem., B 106 (2002) 9546
4. Studenikin S.A., Golego N., and Cocivera M. J. Cryst. Growth 217 1/2 (2000) 131
5. Nagase T., Ooie T., Nakatsuka Y., Shinozaki K., and Mizutani N. Jpn. J. Appl. Phys. 39 7B (2000) L713 (Part 2)
6. Leprince-Wang Y., Wang G.Y., Zhang X.Z., and Yu D.P. J. Cryst. Growth 287 (2006) 89
7. Leung Leung Y.H., Djurišić A.B., Gao J., Xie M.H., Wei Z.F., Xu S.J., and Chan W.K. Chem. Phys. Lett. 394 (2004) 452
8. Leung Y.H., Djurišić A.B., Gao J., Xie M.H., and Chan W.K. Chem. Phys. Lett. 385 (2004) 155
9. Chen Y.Q., Jiang J., He Z.Y., Su Y., Cai D., and Chen L. Mater. Lett. 59 (2005) 3280
10. Andreazza-Vignolle C., Andreazza P., and Zhao D. Superlattices Microstruct. 39 (2006) 340
11. Chen B.J., Sun X.W., and Xu C.X. Ceram. Int. 30 (2004) 1725
12. Taguchi G., Yokoyama Y., and Wu Y. Taguchi Methods/Design of Experiments (1993), American Supplier Institute (ASI) Press, Tokyo, Japan
13. Haluzan I., and Reichenbach D. Circuit World(UK) 17 4 (1991) 24
14. Hu C.Y., Chang Y.J., Yin T., Tsao C.Y., and Chang C.H. Sens. Actuators, B, Chem. 108 1-2 (2005) 665 (SPEC. ISS.)
15. Yim S.L., Yu K.M., Kwok D., and Lee T.C. Mat. Sci. Forum. 471-472 (2004) 891
16. Boire-Lavigne S., Moreau C., and Saint-Jacques R.G. INRS-Energie et Materiaux, Varennes, Que, Can (1993) 473
17. Chen M.R. International Workshop on Statictical Metrology, Proceedings, IWSM (1998) 96
18. White J. Hybrid Circuit Technol. 8 5 (1991) 26
19. Chen W.J., Liu W.L., Hsieh S.H., and Tsai T.K. Appl. Surf. Sci. (2007) 10.1016/j.apsusc.2007.01.091