Static recovery activation energy of pure copper at room temperature

Scripta Materialia

Volumn 57, Issue 8, 2007, Pages 667-670

  Kuo, Chen Ming ^a   Lin, Chih Sheng ^a  

^a I SHOU UNIVERSITY   (Taiwan)

Author keywords

Copper; Recovery; Thermally activated processes; Transmission electron microscopy (TEM)

Indexed keywords

ACTIVATION ENERGY; DISLOCATIONS (CRYSTALS); MORPHOLOGY; STRAIN; TENSILE TESTING; THERMAL ENERGY; TRANSMISSION ELECTRON MICROSCOPY;

ANNIHILATION; ROOM TEMPERATURE; STATIC RECOVERY; SUBGRAINS;

COPPER;

EID: 34547093624     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.06.054     Document Type: Article

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