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Volumn 396, Issue 1-2, 2005, Pages 360-368
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Plastic deformation mechanism of pure copper at low homologous temperatures
a
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Author keywords
Copper; Dislocations; Numerical simulation; Stress rate change; Structural evolution; Thermally activated processes
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Indexed keywords
CHEMICAL ACTIVATION;
COMPUTER SIMULATION;
LOW TEMPERATURE EFFECTS;
PLASTIC DEFORMATION;
REACTION KINETICS;
SENSITIVITY ANALYSIS;
STRESS ANALYSIS;
FLOW KINETICS;
PURE COPPER;
STRESS RATE;
THERMAL ACTIVATION;
COPPER;
TEMPERATURE EFFECT;
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EID: 15944419466
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2005.01.052 Document Type: Article |
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Times cited : (15)
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References (21)
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