Direct writing of conventional thick film inks using MAPLE-DW process

Journal of Laser Micro Nanoengineering

Volumn 1, Issue 1, 2006, Pages 74-78

  Kinzel, Edward C ^a   Xu, Xianfan ^a   Lewis, Brent R ^a   Laurendeau, Normand M ^a   Lucht, Robert P ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

MAPLE DW; Microelectronics; Thick film

Indexed keywords

EID: 34447303643     PISSN: None     EISSN: 18800688     Source Type: Journal    
DOI: 10.2961/jlmn.2006.01.0014     Document Type: Article

References (6)

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4. D. Redinger, S. Molesa, S. Yin, R. Farschi, and V. Subramanian: IEEE Transactions on Electron Devices, 51-12, (2004)
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6. C. Zhang, D. Liu, S.A. Mathews, J. Graves, T.M. Schaefer, B.K. Gilbert, R. Modi, H. Wu, and D.B. Chrisey: Microelectronic Engineering, 70 (2003) 41-49