Millikelvin thermal conductance measurements of compact rigid thermal isolation joints using sapphire-sapphire contacts, and of copper and beryllium-copper demountable thermal contacts

Cryogenics

Volumn 47, Issue 5-6, 2007, Pages 333-342

  Bintley, Dan ^a   Woodcraft, Adam L ^a   Gannaway, Fred C ^a  

^a CARDIFF UNIVERSITY   (United Kingdom)

Author keywords

(A) Joints; (A) Metals; (C) Heat transfer; (D) Instrumentation

Indexed keywords

SAPPHIRE DISCS; SUB-KELVIN TEMPERATURES; THERMAL ISOLATION; THERMAL ISOLATION JOINTS;

ELECTRIC CONDUCTIVITY MEASUREMENT; HEAT TRANSFER; SAPPHIRE; THERMAL EFFECTS;

BOLTED JOINTS;

EID: 34447298633     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cryogenics.2007.04.004     Document Type: Article

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