Thermal conductance measurements of bolted copper to copper joints at sub-Kelvin temperatures

Cryogenics

Volumn 44, Issue 5, 2004, Pages 293-299

  Didschuns, I ^a   Woodcraft, A L ^a   Bintley, D ^a   Hargrave, P C ^a  

^a CARDIFF UNIVERSITY   (United Kingdom)

Author keywords

Contact conductance; Copper; Sub Kelvin

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; GOLD PLATING; JOINTS (STRUCTURAL COMPONENTS); LOW TEMPERATURE EFFECTS; REFRIGERATORS; SURFACE PHENOMENA;

ADIABATIC DEMAGNETIZATION REFRIGERATORS (ADR); CONTACT CONDUCTANCE; SUB-KELVIN TEMPERATURE;

THERMAL CONDUCTIVITY;

EID: 2142821507     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cryogenics.2003.11.010     Document Type: Article

References (25)

1. Swartz E.T., Pohl R.O. Thermal boundary resistance. Rev. Mod. Phys. 61:1989;605.
2. Berman R. Some experiments on thermal contact at low temperatures. J. Appl. Phys. 27:1956;318.
3. Berman R., Mate C.F. Thermal contact at low temperatures. Nature. 182:1958;1661.
4. Okamoto T., Fukuyama H., Ishimoto H., et al. Electrical resistance of screw-fastened thermal joints for ultra-low temperatures. Rev. Sci. Instrum. 61:1990;1332.
5. Fletcher L.S. Recent developments in contact conductance heat transfer. Trans. ASME: J. Heat Transfer. 110:1988;1059.
6. Woodcraft A.L. Comment on 'thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures. J. Phys. D: Appl. Phys. 34:2001;2932.
7. Pobell F. Matter and methods at low temperatures. 1992;Springer.
8. Griffin M, Swinyard B, Vigroux L. SPIRE - Herschel's submillimetre camera and spectrometer. In: Mather JC, editor. IR space telescopes and instruments. Proc SPIE. 2003;4850:686-697.
9. Chase Research, 35 Wolstenholm Road, Sheffield, S7 1LB.
10. Lake Shore Cryotronics, Westerville, OH, USA.
11. Haller E.E. Advanced far-infrared detectors. Infrared Phys. Technol. 35:1994;127.
12. Haller EE, Itoh KM, Beeman JW. Neutron transmutation doped (NTD) germanium thermistors for sub-mm bolometer applications. In: Proc 30th ESLAB Symp "Submillimetre and Far-Infrared Space Instrumentation", 24-26 September 1996, ESA, vol. SP-388. 1996. p. 115-8.
13. Woodcraft A., Sudiwala R.V., Bhatia R.S. The thermal conductivity of C17510 beryllium-copper alloy below 1 K. Cryogenics. 41:2001;603.
14. Lau K.M., Zimmermann W. Jr. Screw-fastened joints for thermal contact at low temperatures. Rev. Sci. Instrum. 50:1979;254.
15. Muething K., Ihas G.G., Landau J. Metallic thermal connectors for use in nuclear refrigeration. Rev. Sci. Instrum. 48:1977;906.
16. Boughton R.I., Brubaker N.R., Sarwinski R.J. Solderless thermal connector for use at low temperatures. Rev. Sci. Instrum. 38:1967;1177.
17. Deutsch M. Thermal conductance in screw-fastened joints at helium temperatures. Cryogenics. 19:1979;273.
18. Manninen M., Zimmermann W. Jr. On the use of screw-fastened joints for thermal contact at low temperatures. Rev. Sci. Instrum. 48:1977;1710.
19. Willekers R.W., Bosch W.A., Mathu F., et al. Impact welding: a superior method of producing joints with high thermal conductivity between metals at very low temperatures. Cryogenics. 29:1989;904.
20. Nilles M.J., Van Sciver S.W. Effects of oxidation and roughness on Cu contact resistance from 4 to 290 K. Clark A.F., Reed R.P. Advances in cryogenic engineering: materials. 34:1988;443-450.
21. Suomi M., Anderson A.C., Holmström B. Heat transfer below 0.2 °K. Physica. 38:1968;67.
22. Corbett K.A., Sawada A., Smith E.N. Thermal and electrical conductance across copper joints below 100 m. K Physica B. 194-196:1994;1211.
23. Fedotov A.O., Mezhov-Deglin L.P., Kasumov A.Yu. Unsuitability of the Wiedemann-Franz law for the description of the relationship between thermal and electrical conductivities of plastically deformed crystals. Sov. Phys. Solid State. 23:1981;177.
24. Fedotov A.O., Mezhov-Deglin L.P. Influence of plastic deformation on the thermal conductivity of pure copper and silver samples. Sov. Phys. Solid State. 24:1982;114.
25. Fonteyn D., Pitsi G. Inelastic scattering in thermal transport properties of deformed copper single crystals. J. Low Temp. Phys. 80:1990;325.