On nonlinear thermomechanical analysis of IC packages

American Society of Mechanical Engineers, EEP

Volumn 1, Issue , 1992, Pages 325-336

  Hsu, Tai Ran ^a  

^a SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); INTEGRATED CIRCUITS; MECHANICAL PROPERTIES; THERMAL STRESS; THERMOANALYSIS;

NONLINEAR THERMOMECHANICAL ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0027101609     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (28)