Improvement of thermal stability of nickel silicide using N2 ion implantation prior to nickel film deposition

Extended Abstracts of the Sixth International Workshop on Junction Technology, IWJT '06

Volumn , Issue , 2006, Pages 176-179

  Kashihara, K ^a   Yamaguchi, T ^a   Okudaira, T ^a   Tsutsumi, T ^a   Maekawa, K ^a   Asai, K ^a   Yoneda, M ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC; DOPING (ADDITIVES); ELECTRIC CONDUCTIVITY; ION IMPLANTATION; THERMODYNAMIC STABILITY;

NICKEL FILM DEPOSITION; NICKEL SUICIDE (NISI); NITROGEN ION IMPLANTATION;

NICKEL COMPOUNDS;

EID: 34250159820     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. T. Morimoto et al., IEDM Tech. Digest (Washington, D.C., 1991) p.653
2. K. Maex., Materials Science and Engineering, R11 (1993) p.53
3. T. Morimoto et al., IEEE Trans. Electron Devices, vol.42, no.5 (1995) p.915
4. K. Suguro et al., Extended Abstract of International Workshop on Junction Technology (Tokyo, Japan, 2002) p.67
5. D. Deduytsche et al., J. Appl. Phys., Vol.98, No.3 (2005) 033526
6. A. S. W. Wong et al., Appl. Phys. Lett., Vol.81, No.27 (2002) p.5138
7. K. Itonaga et al. Symposium on VLSI Technology Digest of Technical Papers (Honolulu, Hawaii, 2002) p. 136
8. O. Nakatsuka et al. Extended Abstract of International Workshop on Junction Technology (Tokyo, Japan, 2002) p.71
9. O. Nakatsuka et al. Advanced Metallization Conference 2004 (Tokyo, Japan, 2004) p. 18
10. O. Nakatsuka et al. Extended Abstract of International Workshop on Junction Technology (Osaka, Japan, 2005) p.91
11. M. Tsuchiaki et al., SSDM Ext. Abst. (Tokyo, Japan, 2003) p.88
12. T. Yamaguchi et al., Advanced Metallization Conference 2005 (Tokyo, Japan, 2005) p.24
13. R. Surdeanu et al., SSDM Ext. Abst. (Tokyo, Japan, 2003) p.740
14. T. Ohguro et al., IEDM Tech. Digest (Washington, D.C., 1995) p.453
15. S. Y. Oh et al., SSDM Ext. Abst. (Tokyo, Japan, 2004) p.442