Simulation of nanoscale polishing of copper with molecular dynamics

Materials Research Society Symposium Proceedings

Volumn 732, Issue , 2002, Pages 102-107

  Ye, Y ^a,b   Biswas, R ^a,b   Morris, J R ^b   Bastawros, A ^c   Chandra, A ^d  

^a Microelectronics Research Center

^b IOWA STATE UNIVERSITY   (United States)

^c IOWA STATE UNIVERSITY   (United States)

^d Iowa State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; DEFECTS; ETCHING; FRICTION; MACHINE TOOLS; MOLECULAR DYNAMICS;

ABRASIVE GEOMETRY; CHIP FORMATION; EMBEDDED ATOM METHOD; MATERIAL DEFECTS; MATERIAL REMOVAL;

CHEMICAL MECHANICAL POLISHING;

EID: 34249890828     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-732-i4.8     Document Type: Conference Paper

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