-
2
-
-
0033737207
-
Next generation integral passives: Materials, processes, and integration of resistors and capacitors on PWB substrates
-
S. K. Bhattacharya and R. R. Tummala, "Next generation integral passives: Materials, processes, and integration of resistors and capacitors on PWB substrates," J. Mater. Sci.-Mater. Electron., vol. 11, pp. 253-268, 2000.
-
(2000)
J. Mater. Sci.-Mater. Electron
, vol.11
, pp. 253-268
-
-
Bhattacharya, S.K.1
Tummala, R.R.2
-
3
-
-
0035192693
-
Integral passives for next generation of electronic packaging: Application of epoxy/ceramic nanocomposites as integral capacitors
-
S. K. Bhattacharya and R. R. Tummala, "Integral passives for next generation of electronic packaging: Application of epoxy/ceramic nanocomposites as integral capacitors," Microelectron. J., vol. 32, pp. 11-19, 2001.
-
(2001)
Microelectron. J
, vol.32
, pp. 11-19
-
-
Bhattacharya, S.K.1
Tummala, R.R.2
-
4
-
-
0037203632
-
Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application
-
Y. Rao, S. Ogitani, P. Kohl, and C. P. Wong, "Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application," J. Appl. Polym. Sci., vol. 83, pp. 1084-1090, 2002.
-
(2002)
J. Appl. Polym. Sci
, vol.83
, pp. 1084-1090
-
-
Rao, Y.1
Ogitani, S.2
Kohl, P.3
Wong, C.P.4
-
5
-
-
0034481968
-
A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory
-
Dec
-
Y. Rao, J. M. Qu, T. Marinis, and C. P. Wong, "A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory," IEEE Trans. Comp. Packag. Technol., vol. 23, no. 4, pp. 680-683, Dec. 2000.
-
(2000)
IEEE Trans. Comp. Packag. Technol
, vol.23
, Issue.4
, pp. 680-683
-
-
Rao, Y.1
Qu, J.M.2
Marinis, T.3
Wong, C.P.4
-
6
-
-
0141642003
-
Di-block copolymer surfactant study to optimize filler dispersion in high dielectric constant polymer-ceramic composite
-
Y. Rao, A. Takahashi, and C. P. Wong, "Di-block copolymer surfactant study to optimize filler dispersion in high dielectric constant polymer-ceramic composite," Compos. A - Appl. Sci. Manufact., vol. 34, pp. 1113-1116, 2003.
-
(2003)
Compos. A - Appl. Sci. Manufact
, vol.34
, pp. 1113-1116
-
-
Rao, Y.1
Takahashi, A.2
Wong, C.P.3
-
7
-
-
1842763692
-
Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications
-
Y. Rao and C. P. Wong, "Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications," J. Appl. Polym. Sci., vol. 92, pp. 2228-2231, 2004.
-
(2004)
J. Appl. Polym. Sci
, vol.92
, pp. 2228-2231
-
-
Rao, Y.1
Wong, C.P.2
-
8
-
-
0031631756
-
Improvements and recent advances in nanocomposite capacitors using a colloidal technique
-
V. Agarwal, P. Chahal, R. R. Tummala, and M. G. Allen, "Improvements and recent advances in nanocomposite capacitors using a colloidal technique," in Proc. 48th Electron. Comp. Technol. Conf., 1998, pp. 165-170.
-
(1998)
Proc. 48th Electron. Comp. Technol. Conf
, pp. 165-170
-
-
Agarwal, V.1
Chahal, P.2
Tummala, R.R.3
Allen, M.G.4
-
9
-
-
0033727086
-
Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors
-
May
-
S. Ogitani, S. A. Bidstrup-Allen, and P. A. Kohl, "Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors," IEEE Trans. Adv. Packag., vol. 23, no. 2, pp. 313-322, May 2000.
-
(2000)
IEEE Trans. Adv. Packag
, vol.23
, Issue.2
, pp. 313-322
-
-
Ogitani, S.1
Bidstrup-Allen, S.A.2
Kohl, P.A.3
-
10
-
-
0242333977
-
Colloidal processing of polymer ceramic nanocomposite integral capacitors
-
Apr
-
H. Windlass, P. M. Raj, D. Balaraman, S. K. Bhattacharya, and R. R. Tummala, "Colloidal processing of polymer ceramic nanocomposite integral capacitors," IEEE Trans. Electron. Packag. Manufact., vol. 26, no. 2, pp. 100-105, Apr. 2003.
-
(2003)
IEEE Trans. Electron. Packag. Manufact
, vol.26
, Issue.2
, pp. 100-105
-
-
Windlass, H.1
Raj, P.M.2
Balaraman, D.3
Bhattacharya, S.K.4
Tummala, R.R.5
|