Surface current modelling of the skin effect for on-chip interconnections

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 2, 2007, Pages 342-349

  De Zutter, Daniël ^a   Rogier, Hendrik ^a   Knockaert, Luc ^a   Sercu, Jeannick ^b  

^a GHENT UNIVERSITY   (Belgium)

^b AGILENT TECHNOLOGIES   (Belgium)

Author keywords

On chip interconnect; Resistance and inductance matrices; Skin effect; Surface impedance admittane

Indexed keywords

ELECTRIC ADMITTANCE; ELECTRIC CURRENTS; ELECTRIC IMPEDANCE; ELECTRIC RESISTANCE; INDUCTANCE; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; SKIN EFFECT;

ON-CHIP INTERCONNECT; SURFACE ADMITTANCE; SURFACE CURRENT; SURFACE IMPEDANCE;

INTERCONNECTION NETWORKS;

EID: 34249776341     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.895984     Document Type: Conference Paper

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