A JMAK-microhardness model for quantifying the kinetics of restoration mechanisms in inhomogeneous microstructure

Materials Science and Engineering: A

Volumn 464, Issue 1-2, 2007, Pages 68-75

  Kalu, P N ^a   Waryoba, D R ^a  

^a FAMU FSU COLLEGE OF ENGINEERING   (United States)

Author keywords

Grain growth; Kinetics; OFHC copper; Recovery; Recrystallization; Wire drawn

Indexed keywords

ACTIVATION ENERGY; ANNEALING; GRAIN GROWTH; METAL RECOVERY; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; RECRYSTALLIZATION (METALLURGY); WIRE DRAWING;

INHOMOGENEOUS MICROSTRUCTURE; OXYGEN FREE HIGH CONDUCTING (OFHC) COPPER;

COPPER;

ACTIVATION ENERGY; ANNEALING; COPPER; GRAIN GROWTH; METAL RECOVERY; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; RECRYSTALLIZATION (METALLURGY); WIRE DRAWING;

EID: 34248577150     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.01.124     Document Type: Article

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