Effect of adhesive material properties on induced stresses in bonded sensors

AIP Conference Proceedings

Volumn 894, Issue , 2007, Pages 1524-1531

  Martin, Steven A ^b   Blackshire, James L ^a  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b NDE Computational Consultants   (United States)

Author keywords

Adhesively bonded sensors; Induced stress; Structural health monitoring

Indexed keywords

EID: 34248233516     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2718146     Document Type: Conference Paper

References (6)

1. J. L. Blackshire and A. T. Cooney, "Characterization of Bonded Piezoelectric Sensor Performance and Durability in Simulated Aircraft Environments," in Review of Progress in Quantitative Nondestructive Evaluation 25B, edited by D. O. Thompson and D. E. Chimenti, AIP Conference Proceedings vol. 820, American Institute of Physics, Melville, NY, 2005, pp. 1694-1701.
2. L.R.F. Rose, "Theoretical Analysis of Crack Patching" in Bonded Repair of Aircraft Structures, edited by A.A. Baker and A. Jones, Martinus Nihoff Publishers, Hingham, MA, USA, 1988.
3. L.J. Hart-Smith, "Analysis and design of advanced composite bonded joints", NASA Contractor Rep. CR-2218 (1974).
4. J.D. Eschelby, Proc. R. Soc. London, A241, 376-396 (1957).
5. R. C. Juvinall, Engineering Considerations of Stress, Strain, and Strength, McGraw-Hill, U.S.A., pp. 128-130 (1967).
6. W.B. Fraser, Int. J. Solids Structures, 11, 1245-1256 (1975).