Key problems in microforming processes of microparts

Journal of Materials Science and Technology

Volumn 23, Issue 2, 2007, Pages 283-288

  Wang, Chunju ^a   Shan, Debin ^a   Guo, Bin ^a   Zhou, Jian ^a   Sun, Lining ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Floating microdie; Microforming; Microforming apparatus; Microgears; Size effects

Indexed keywords

ELECTRON DEVICES; FABRICATION; GEARS; MACHINE COMPONENTS; MICROELECTROMECHANICAL DEVICES; PRODUCTION;

FLOATING MICRODIE; MICROFORMING; MICROFORMING APPARATUS; MICROGEARS; MICROPARTS; SIZE EFFECTS;

FORMING;

EID: 34248214508     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)

1. M. Geiger, M. Kleiner and R. Echstein: Annals CIRP, 2001, 50(2), 445.
2. A. Gillner, D. Hellrung, A. Bayer, F. Schepp and R. Erliardt: Umformtechnisches Kolloquium Darmstadt, 2000, 7, 107.
3. M. Geiger and U. Engel: J. JSTP, 2002, 494(43), 5.
4. F. Vollertsen, H. S. Niehoff and Z. Hu: Froc. of the 1st ICNFT, eds. by Z. R. Wang and T. A. Dean, Harbin, China, 2004, 17.
5. Y. Saotome, A. Itoh and S. Amada: Proc. of the 4th ICTP, ed. by Z. R. Wang, Beijing, China, 1993, 2000.
6. Y. Saotome, K. Imai, S. Shioda, S. Shimizu, T. Zhang and A. Inoue: Intermetallics, 2002, 10, 1241.
7. Y. Saotome and H. Iwazaki: J. Mater. Process. Technol., 2001, 119, 307.
8. F. Schepp: Berichte aus Produktion und Umformtechnik, Shaker Verlag, Aachen, 2002, 54.
9. N. Tiesler, U. Engel and M. Geiger: Proc. of the 6th ICTP, ed. by M. Geiger, Nuremberg, Bavaria, Germany, 1999, 2, 889.
10. M. Geiger, A. Messner and U. Engel: Prod. Engineer., 1997, 4(1), 55.
11. U. Engel and A. Messner: Wire, 1998, 2, 94.
12. L. V. Raulea, L. E. Govaert and F. P. T. Baaijens: Proc. of the 6th ICTP, ed. by M. Geiger, Nuremberg, Bavaria, Germany, 1999, 2, 939.
13. T. A. Kals and R. Eckstein: J. Mater. Process. Technol., 2000, 103, 95.
14. P. Picard and J. F. Michel: Proc. of the 6th ICTP, ed. by M. Geiger, Nuremberg, Bavaria, Germany, 1999, 2, 895.
15. N. Tiesler, U. Engel and M. Geiger: Proc. of the 7th ICTP, eds. by M. Kiuchi, H. Nishimura and J. Yanagimoto, Yokohama, Japan, 2002, 1, 379.
16. F. Vollertsen, Z. Hu, H. S. Niehoff and C. Theiler: J. Mater. Process. Technol., 2004, 151, 70.
17. T. Masuzawa: Annals CIRP, 2000, 49(2), 473.
18. C. Wang, D. Shan, B. Guo and L. Sun: Proc. of the 8th ICTP, ed. by P. F. Bariani, Verona, Italy, 2005, 457.
19. H. Yasin, H. M. Zbib and M. A. Khaleel: Mater. Sci. Eng., 2001, 309-310, 294.
20. H. Margolin: Acta Mater., 1998, 17, 6305.