CNTs attractive alternative for interconnects

Semiconductor International

Volumn 30, Issue 5, 2007, Pages 26-

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EID: 34248214195     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (1)

1. G. Close et al, "Nanostructured Materials for Interconnects," Advanced Metallization Conf. Proc., 2006, p. 3.